By Wen-Yee Lee

TAIPEI, July 13 (Reuters) – Taiwan Semiconductor Manufacturing Co (TSMC) will add two advanced chip packaging ​plants in the Chiayi Science ‌Park, the island’s science and expertise minister stated on Sunday.

Located in southern Taiwan, the Chiayi Science Park is being developed ‌as ​certainly one of TSMC’s main ⁠advanced chip-packaging hubs.

TSMC’s ⁠first advanced chip packaging plant on the Chiayi Science Park has already entered mass manufacturing and its ​second plant is anticipated to start mass manufacturing quickly, National Science ⁠and Technology Council ⁠Minister Wu Cheng-wen stated at ​a groundbreaking ceremony.

(*2*) Wu stated, including that the park is anticipated to generate ⁠greater than 300 billion Taiwan {dollars} ($9.35 billion) in annual manufacturing worth and create extra ⁠than 9,000 ‌jobs as soon as all 4 plants ⁠are up and operating.

TSMC is ​quickly ‌increasing its advanced chip-packaging ​capability, together with ⁠its chip-on-wafer-on-substrate expertise, as demand from synthetic intelligence chip designers like Nvidia continues to outstrip provide.

($1 = 32.0970 Taiwan {dollars})

(Reporting by Wen-Yee Lee; Editing by ​Thomas Derpinghaus)



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