TAIPEI — Taiwan Semiconductor Manufacturing Co (TSMC) will add two advanced chip packaging plants in the Chiayi Science Park, the island’s science and expertise minister stated on Sunday (July 12).
Located in southern Taiwan, the Chiayi Science Park is being developed as certainly one of TSMC’s main advanced chip-packaging hubs.
TSMC’s first advanced chip packaging plant on the Chiayi Science Park has already entered mass manufacturing and its second plant is predicted to start mass manufacturing quickly, National Science and Technology Council Minister Wu Cheng-wen stated at a groundbreaking ceremony.
“Today’s groundbreaking marks the start of the second phase, which will include a third and fourth plant,” Wu stated, including that the park is predicted to generate greater than 300 billion Taiwan {dollars} (S$12.1 billion) in annual manufacturing worth and create greater than 9,000 jobs as soon as all 4 plants are up and working.
TSMC is quickly increasing its advanced chip-packaging capability, together with its chip-on-wafer-on-substrate expertise, as demand from synthetic intelligence chip designers like Nvidia continues to outstrip provide.
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