Taipei, Jan. 13 (CNA) Taiwan’s National Institutes of Applied Research (NIAR) has launched an open R&D platform that includes a chip-level packaging technique that eliminates the usage of substrates as a part of its effort to bolster the nation’s superior packaging ecosystem.
NIAR’s Taiwan Semiconductor Research Institute (TSRI) offered the packaging platform at a press occasion in Taipei on Tuesday, saying that the technique will assist shift Taiwan’s aggressive edge within the chip trade from manufacturing processes to system integration and utility innovation.
Wu Cheng-wen (吳誠文), minister of the National Science and Technology Council and NIAR chairperson, stated superior packaging is the important thing to future AI functions that require chips providing greater efficiency, greater density, and decrease energy consumption.
The newly unveiled Chip-on-Chip-on-Board (CoCoB) structure represents a specialised method in comparison with Chip-on-Wafer-on-Substrate (CoWoS) — probably the most superior packaging applied sciences presently employed by Taiwan Semiconductor Manufacturing Co. (TSMC) — TSRI Deputy Director General Juang Ying-zong (莊英宗) stated.
While CoWoS achieves high-density integration of computing chips and excessive bandwidth reminiscence (HBM) utilizing interposer wafers and substrates, the substrate layer presents challenges when it comes to value, sign transmission distance, and course of complexity, Juang defined.
In the CoCoB structure, the interposer chip is immediately linked to the circuit board, successfully enhancing integration density and system efficiency by considerably shortening sign transmission paths, he stated.
Juang likened the technical problem to “placing a large sheet of tempered glass onto a pebble-covered ground while ensuring every single contact point is precisely connected.” The TSRI overcame this by implementing a flowable interface materials beneath every micro-solder ball to make sure that all connection factors are reliably bonded.
By eliminating substrate prices and decreasing course of complexity, CoCoB is especially well-suited for tutorial establishments and startups to conduct high-flexibility, low-cost heterogeneous integration experiments, TSRI stated.
To date, the challenge has attracted participation from 16 professor-led research groups from Taiwan and overseas, in keeping with Juang.