CXL-enabled idle I/O bandwidth harvesting; tunnel FETs; adv. packaging thermal regulation; RRAM-based computing-in-memory; nanopore warmth dissipation; deformable mix skinny movies of polymer semiconductors; information sharing in IC manufacturing; scalable fabrication of nano-OLEDs; DeepSeek’s new AI fashions; analog basis fashions.

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New technical papers lately added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Pushing the Memory Bandwidth Wall with CXL-enabled Idle I/O Bandwidth Harvesting Georgia Tech
A color-coded light-induced heating technology for Pb-free solder joints of superior multi-semiconductor packaging Sungkyunkwan Univ.
Special Session Paper: Formal Verification
Techniques and Reliability Methods for
RRAM-based Computing-in-Memory
Univ. of Bremen, DFKI, Univ. of Florida, TU Munich
Gate-Tunable Ionothermoelectric Cooling in a Solid-State Nanopore Univ. of Osaka, Univ. of Tokyo, AIST et al.
Next-generation tunnel FETs: Surpassing the Energy Efficiency of Conventional MOSFETs Sandia National Laboratories
Polymer semiconductor blends with remarkably secure semiconducting efficiency beneath giant and cyclic mechanical deformation Chinese Academy of Sciences, RIKEN
Artificial Intelligence with Open and Scaled Data Sharing in Semiconductor Manufacturing – Workshop Report NIST
Scalable nanopatterning of natural light-emitting diodes past the diffraction restrict ETH Zurich, Univ. of Alberta, IISc, Huazhong Univ. of Science and Technology
DeepSeek’s New AI Models DeepSeek
Analog Foundation Models IBM Research– Zurich, ETH Zurich, IBM Research-Almaden, IBM TJ Watson Research Center

Find extra semiconductor research papers here and in the newest Chip Industry Week in Review.

 

Emma Riverso

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Emma Riverso is an affiliate editor at Semiconductor Engineering.



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